Our fully automated SMT line ensures precise and efficient placement of surface-mount components using advanced pick-and-place equipment and reflow ovens. To maintain top-tier quality, we employ SPI (Solder Paste Inspection) to verify solder paste volume before component placement and AOI (Automated Optical Inspection) to detect any defects after soldering.

Designed for through-hole component assembly, our auto-insertion line boosts production speed while enhancing consistency. Each board undergoes rigorous AOI checks post-insertion to ensure pin alignment and soldering quality, making it suitable for heavy-duty and industrial applications.

Our manual line handles assembly processes that require human expertise and flexibilitysuch as DIP (Dual In-line Package) insertion, heat sink attachment, and other non-automated tasks. This line supports small to medium-scale production runs and is ideal for components or processes that cannot be completed through SMT or automated systems. All assemblies undergo final ICT (In-Circuit Testing) to ensure they meet our high quality standards.