Heller 1809 MKIII (Mark III)
SKU : M2K000069
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Short Description
The Heller 1809 MKIII (Mark III) is a high-performance reflow oven for PCB assembly in SMT (Surface Mount Technology) manufacturing processes. This model is designed to support lead-free soldering applications requiring high temperature stability and precise heat control.
⚙️ Key Technical Specifications
- Heating Zones: A total of 9 zones on the top and 9 zones on the bottom (18 independently controlled zones in total), each 250 mm long, allowing for highly precise and accurate temperature gradient (profile sculpting).
- Cooling Zones: Equipped with 2 internal cooling zones to quickly reduce the temperature of the circuit boards before they exit the machine. - To create a complete lead solder crystal structure:
- Conveyor System: Equipped with an edge rail conveyor and a mesh belt combo, adjustable to fit PCB widths up to approximately 18-20 inches (457-508 mm).
- Heat Control and Precision: Utilizes Forced Hot Air Convection technology with very low cross-belt temperature deviation (±2°C), ensuring even heat distribution across the circuit board.
- Operating Temperature: Supports a standard maximum temperature of 350°C (with optional upgrades to 400°C).
